# GPT Image Hub prompt

## 谷歌TPU供应链信息图
- URL: https://www.gptimagehub.com/zh-CN/library/google-tpu-supply-chain-infographic
- Generator URL: https://www.gptimagehub.com/zh-CN/generate?promptId=oss-ym-g2-18628
- Markdown URL: https://www.gptimagehub.com/api/agent/markdown?path=%2Fzh-CN%2Flibrary%2Fgoogle-tpu-supply-chain-infographic
- Category: 信息图与教育
- Model: gpt-image-2
- Aspect ratio: 16:9
- Style: graphic-design
- Tags: 信息图, 半导体, 谷歌tpu, 硬件, 等轴测, 赛博朋克, 数据流
- Updated: 2026-10-26T23:12:33.098Z
- Created: 2026-10-26T23:12:33.098Z

生成等轴测霓虹青色科技信息图，展现谷歌TPU硬件产业链及TPU与GPU的对比。可修改节点、公司名称与对比参数以展示其他生态。

### Full prompt
```text
{"type":"宽屏未来科技产业信息图","title":"[GOOGLE TPU ECOSYSTEM: VERTICAL INTEGRATION & CHALLENGING NVIDIA]","style":"深蓝底色等轴测矢量信息图，发光青色电路路径，霓虹高光，3D芯片与数据中心图标，整洁的企业科技展示风格，带微弱投影的高对比度白色大写英文标签，16:9横向画幅","layout":{"background":"带隐约电路纹理的蓝灰渐变底色，所有节点由明亮的青色数据流线条相连","main_flow":"从左至右展开的生态图谱，展示Google TPU从算法、ASIC设计到晶圆制造、网络互联、系统组装和AI模型训练的完整产业链","discrete_labeled_sections_count":8,"sections":[{"title":"GOOGLE BRAIN: ALGORITHMS","position":"左上","visual":"发光大脑轮廓图标，向下游生态注入青色数据流"},{"title":"DESIGN TRANSFORMERS: CUSTOM ASIC DESIGN","position":"左中","count":2,"labels":["BROADCOM","MEDIATEK"],"visual":"箭头相连的两个小型芯片设计工作台，左侧为Broadcom，右侧为MediaTek"},{"title":"HIGH-SPEED CONNECTIVITY","position":"左下","visual":"接入中央TPU封装基板的精密电路走线与发光数据链路"},{"title":"PHYSICAL BUILDERS","position":"顶部中央","count":1,"labels":["TSMC"],"visual":"亮蓝屋顶核心的等轴测半导体晶圆厂，垂直连接至中央芯片"},{"title":"FABRICATION & PACKAGING","position":"底部中央","count":1,"labels":["TSMC"],"visual":"位于电路基底上的大型核心堆叠TPU芯片封装，青色发光晶圆核心，多层封装结构"},{"title":"NETWORK NERVOUS","position":"中右上方","count":1,"labels":["ZHONGJI INNOLIGHT"],"visual":"由发光网格拓扑互联的服务器机群，数据流向下输送"},{"title":"SYSTEM ASSEMBLY","position":"右中","count":1,"labels":["INVENTEC"],"visual":"接入主TPU流水线的机架式服务器与长条形组装模块"},{"title":"AI MODEL TRAINING (GEMINI)","position":"右下","visual":"由互联节点组成的大型发光线框球体，代表AI训练算力成果"}]},"comparison_panel":{"title":"CORE CONTRAST: TPU VS. GPU","position":"右上","panel_style":"垂直分割的圆角矩形卡片，左侧为青色Google TPU，右侧为紫色Nvidia GPU","columns_count":2,"columns":[{"heading":"GOOGLE TPU","icon":"青色处理器图标","points_count":3,"points":["PERFORMANCE EFFICIENCY (Watt/Perf)","COST OPTIMIZATION","VERTICAL INTEGRATION ADVANTAGE"]},{"heading":"NVIDIA GPU","icon":"标有GPU字样的紫色芯片图标","points_count":3,"points":["POWERFUL CUDA ECOSYSTEM","POWER & COST CHALLENGES","作为对比指示箭头的VERTICAL INTEGRATION ADVANTAGE"]}]},"visual_elements":{"company_labels_count":5,"company_labels":["BROADCOM","MEDIATEK","TSMC","ZHONGJI INNOLIGHT","INVENTEC"],"major_icons_count":9,"major_icons":["大脑图标","两台ASIC设计工作台","半导体制造厂","中央封装TPU芯片","网络服务器网格","机架组装模块","对比卡片","GPU芯片","AI训练球体"]},"customization":"确保所有文本清晰且为纯英文，严格保留大写标签，呈现专业金融科技研报级信息图质感。用明亮青色数据流光强调[垂直整合与挑战英伟达]，展现高端科技美学。"}
```